封装 / 外壳:
176-LQFP Exposed Pad
供应商器件封装:
176-LQFP-EP (24x24)
协处理器/数字信号处理器:
Multimedia; NEON™ MPE
显示与接口控制器:
DCU, GPU, LCD, VideoADC, VIU
通用串行总线:
USB 2.0 OTG + PHY (1)
安全特性:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
附加接口:
CANbus, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART
内存控制器:
DDR3, DRAM, LPDDR2