封装 / 外壳:
176-LQFP Exposed Pad
供应商器件封装:
176-HLQFP (24x24)
协处理器/数字信号处理器:
Multimedia; NEON™ MPE
内存控制器:
LPDDR2, DDR3, DRAM
显示与接口控制器:
DCU, GPU, LCD, VideoADC, VIU
通用串行总线:
USB 2.0 OTG + PHY (1)
安全特性:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
附加接口:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART